BMI-C-007-01
- Manufacturer
- Laird Technologies EMI
- Product Category
- RFI and EMI - Contacts, Fingerstock and Gaskets
- Description
- CONTACT BECU 3.3X1.0MM
- Manufacturer :
- Laird Technologies EMI
- Product Category :
- RFI and EMI - Contacts, Fingerstock and Gaskets
- Attachment Method :
- Solder
- Height :
- 0.126" (3.20mm)
- Length :
- 0.130" (3.30mm)
- Material :
- Beryllium Copper
- Operating Temperature :
- -
- Packaging :
- Cut Tape (CT)
- Part Status :
- Active
- Plating :
- Tin
- Plating - Thickness :
- -
- Series :
- BMI-C
- Shape :
- -
- Type :
- Shield Finger
- Width :
- 0.059" (1.50mm)
- Datasheet :
- BMI-C-007-01
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| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| BMI-C-001 | Laird Technologies EMI | 54,000 | CONTACT BECU 3.1X2.5MM |
| BMI-C-001 | Laird Technologies EMI | 56,587 | CONTACT BECU 3.1X2.5MM |
| BMI-C-001 | Laird Technologies EMI | 56,587 | CONTACT BECU 3.1X2.5MM |
| BMI-C-001-SN | Laird Technologies EMI | 5,000 | SP CON S SN TNR |
| BMI-C-002 | Laird Technologies EMI | 3,500 | CONTACT RETAINER FOR BOARDSHIELD |
| BMI-C-002 | Laird Technologies EMI | 6,982 | CONTACT RETAINER FOR BOARDSHIELD |
| BMI-C-002 | Laird Technologies EMI | 6,982 | CONTACT RETAINER FOR BOARDSHIELD |
| BMI-C-004 | Laird Technologies EMI | 7,000 | CONTACT BECU 6.0X4.3MM |
| BMI-C-004 | Laird Technologies EMI | 8,226 | CONTACT BECU 6.0X4.3MM |
| BMI-C-004 | Laird Technologies EMI | 8,226 | CONTACT BECU 6.0X4.3MM |
| BMI-C-004-SN | Laird Technologies EMI | 5,000 | SP CON S SN TNR |
| BMI-C-006 | Laird Technologies EMI | 3,500 | CONTACT BECU 2.9X1.5MM |
| BMI-C-006 | Laird Technologies EMI | 8,854 | CONTACT BECU 2.9X1.5MM |
| BMI-C-006 | Laird Technologies EMI | 8,854 | CONTACT BECU 2.9X1.5MM |
| BMI-C-007-01 | Laird Technologies EMI | 2,300 | CONTACT BECU 3.3X1.0MM |