67SLG030030050PI00
- Manufacturer
- Laird Technologies EMI
- Product Category
- RFI and EMI - Contacts, Fingerstock and Gaskets
- Description
- METAL FILM OVER FOAM CONTACTS
- Manufacturer :
- Laird Technologies EMI
- Product Category :
- RFI and EMI - Contacts, Fingerstock and Gaskets
- Attachment Method :
- Solder
- Height :
- 0.118" (3.00mm)
- Length :
- 0.197" (5.00mm)
- Material :
- Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Operating Temperature :
- -40°C ~ 70°C
- Packaging :
- Digi-Reel®
- Part Status :
- Active
- Plating :
- -
- Plating - Thickness :
- -
- Series :
- SMD Grounding Metallized
- Shape :
- Rectangle
- Type :
- Film Over Foam
- Width :
- 0.118" (3.00mm)
- Datasheet :
- 67SLG030030050PI00
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|---|---|---|---|
| 67SLA060080070PI00 | Laird Technologies EMI | 5,000 | SLA W6XH8XL7MM |
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| 67SLG030030050PI00 | Laird Technologies EMI | 13,200 | METAL FILM OVER FOAM CONTACTS |
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| 67SLG040035030PI00 | Laird Technologies EMI | 5,000 | METAL FILM OVER FOAM CONTACTS |
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| 67SLG040035030PI00 | Laird Technologies EMI | 1,940 | METAL FILM OVER FOAM CONTACTS |
| 67SLG040040025PI00 | Laird Technologies EMI | 5,000 | METAL FILM OVER FOAM CONTACTS |
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| 67SLG040040025PI00 | Laird Technologies EMI | 5,000 | METAL FILM OVER FOAM CONTACTS |
| 67SLG050050030PI00 | Laird Technologies EMI | 5,000 | METAL FILM OVER FOAM CONTACTS |
| 67SLG050050030PI00 | Laird Technologies EMI | 5,000 | METAL FILM OVER FOAM CONTACTS |
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| 67SLG050060050PI00 | Laird Technologies EMI | 19,550 | METAL FILM OVER FOAM CONTACTS |
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