100-1500-1
- Manufacturer
- BECOM Systems GmbH
- Product Category
- Embedded - Microcontroller, Microprocessor, FPGA Modules
- Description
- IC MODULE I.MX537 800MHZ 1GB
- Manufacturer :
- BECOM Systems GmbH
- Product Category :
- Embedded - Microcontroller, Microprocessor, FPGA Modules
- Co-Processor :
- -
- Connector Type :
- Qseven Card-Edge 230
- Core Processor :
- i.MX537
- Flash Size :
- 2GB (NAND), 4MB (NOR)
- Module/Board Type :
- MPU Core
- Operating Temperature :
- -40°C ~ 85°C
- Part Status :
- Obsolete
- RAM Size :
- 1GB
- Series :
- i.MX
- Size / Dimension :
- 2.76" x 2.76" (70mm x 70mm)
- Speed :
- 800MHz
- Datasheet :
- 100-1500-1
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| 100-006-000 | 3M | 5,000 | CONN IC DIP SOCKET 6POS GOLD |
| 100-006-050 | 3M | 5,000 | CONN IC DIP SOCKET 6POS GOLD |
| 100-008-000 | 3M | 5,000 | CONN IC DIP SOCKET 8POS GOLD |
| 100-008-001 | 3M | 5,000 | CONN IC DIP SOCKET 8POS GOLD |
| 100-008-050 | 3M | 5,000 | CONN IC DIP SOCKET 8POS GOLD |
| 100-008-051 | 3M | 5,000 | CONN IC DIP SOCKET 8POS GOLD |
| 100-010-000 | 3M | 5,000 | CONN IC DIP SOCKET 10POS GOLD |
| 100-010-050 | 3M | 5,000 | CONN IC DIP SOCKET 10POS GOLD |
| 100-014-000 | 3M | 5,000 | CONN IC DIP SOCKET 14POS GOLD |
| 100-014-001 | 3M | 5,000 | CONN IC DIP SOCKET 14POS GOLD |
| 100-014-050 | 3M | 5,000 | CONN IC DIP SOCKET 14POS GOLD |
| 100-014-051 | 3M | 5,000 | CONN IC DIP SOCKET 14POS GOLD |
| 100-016-000 | 3M | 5,000 | CONN IC DIP SOCKET 16POS GOLD |
| 100-016-001 | 3M | 5,000 | CONN IC DIP SOCKET 16POS GOLD |
| 100-016-050 | 3M | 5,000 | CONN IC DIP SOCKET 16POS GOLD |