THINC23-21.5-11.4-5.8-0.8
- Manufacturer
- t-Global Technology
- Product Category
- Thermal - Pads, Sheets
- Description
- THERM PAD 21.5X11.4MMX5.8MM GRAY
- Manufacturer :
- t-Global Technology
- Product Category :
- Thermal - Pads, Sheets
- Adhesive :
- -
- Backing, Carrier :
- -
- Color :
- Gray
- Material :
- Silicone
- Outline :
- 21.50mm x 11.40mm x 5.80mm
- Part Status :
- Obsolete
- Series :
- THINC
- Shape :
- Rectangular
- Thermal Conductivity :
- 1.9W/m-K
- Thermal Resistivity :
- -
- Thickness :
- 0.0315" (0.800mm)
- Type :
- Interface Cap
- Usage :
- -
- Datasheet :
- THINC23-21.5-11.4-5.8-0.8
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| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| THINC22-TO220-16-11.4-5.8-0.3 | t-Global Technology | 291 | THERM PAD 16MMX11.4MMX5.8MM GRAY |
| THINC22-TO220-16-11.4-5.8-0.45 | t-Global Technology | 4,620 | THERM PAD 16MMX11.4MMX5.8MM GRAY |
| THINC23-TO220-21.5-11.4-5.8-0.3 | t-Global Technology | 53,567 | THERM PAD 21.5MMX11.4MMX5.8MM |
| THINC23-TO220-21.5-11.4-5.8-0.45 | t-Global Technology | 604 | THERM PAD 21.5MMX11.4MMX5.8MM |
| THINC33-TO247-28.5-17.5-5.8-0.3 | t-Global Technology | 20,047 | THERM PAD 28.5MMX17.5MMX5.8MM |
| THINC33-TO247-28.5-17.5-5.8-0.45 | t-Global Technology | 6,491 | THERM PAD 28.5MMX17.5MMX5.8MM |