HS31

Manufacturer
Apex Microtechnology
Product Category
Thermal - Heat Sinks
Description
HEATSINK OPEN FRAME
Manufacturer :
Apex Microtechnology
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Height Off Base (Height of Fin) :
1.310" (33.27mm)
Length :
5.421" (139.70mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
-
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Series :
Apex Precision Power®
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
0.40°C/W @ 800 LFM
Thermal Resistance @ Natural :
1.46°C/W
Type :
Board Level
Width :
4.812" (122.22mm)
Datasheet :
HS31

Manufacturer related products

  • Apex Microtechnology
    IC AMP GENERAL PURPOSE TO3-8
  • Apex Microtechnology
    IC AMP GENERAL PURPOSE TO3-8
  • Apex Microtechnology
    IC AMP GENERAL PURPOSE TO3-8
  • Apex Microtechnology
    IC AMP GENERAL PURPOSE TO3-8
  • Apex Microtechnology
    IC OPAMP GP 1 CIRCUIT 34FD

Catalog related products

  • CTS Electronic Components
    THERMAL LINK PRESS ON BLK TO-5
  • Sanyo Denki
    P4,CELERON,1.7-3.2GHZ,FC-PGA2
  • TE Connectivity
    V-2461 = 47.5MM HS ASSY ALUM C
  • TE Connectivity
    HTS01-A=GRID ARRAY ASSY
  • TE Connectivity
    HEAT SINK ASSY 29MM

related products

Part Manufacturer Stock Description
HS3120B2 SIPEX 30,000 Integrated Circuit