BDN11-3CB/A01

Manufacturer :

CTS Electronic Components

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Included)

Diameter :

-

Height Off Base (Height of Fin) :

0.355" (9.02mm)

Length :

1.110" (28.19mm)

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Series :

BDN

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

7.20°C/W @ 400 LFM

Thermal Resistance @ Natural :

20.90°C/W

Type :

Top Mount

Width :

1.110" (28.19mm)