2-1437542-7

Manufacturer
TE Connectivity
Product Category
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 20POS GOLD
Manufacturer :
TE Connectivity
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
20.0µin (0.51µm)
Contact Finish Thickness - Post :
20.0µin (0.51µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Carrier, Closed Frame
Housing Material :
Aluminum Alloy
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
20 (2 x 10)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Obsolete
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
700
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datasheet :
2-1437542-7

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