169-PGM13001-10

Manufacturer :

Aries Electronics, Inc.

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

-

Housing Material :

Polyamide (PA46), Nylon 4/6, Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

-

Operating Temperature :

-

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

PGM

Termination :

Solder

Type :

PGA