SIP41430-001LF

Manufacturer :

Amphenol ICC

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

200.0µin (5.08µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polyamide (PA), Nylon

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

2 (1 x 2)

Operating Temperature :

-

Packaging :

Tape & Reel (TR)

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

-

Termination :

Solder

Type :

SIP