818-AG11D-ESL
- Manufacturer
- TE Connectivity
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN IC DIP SOCKET 18POS GOLD
- Manufacturer :
- TE Connectivity
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- Flash
- Contact Finish Thickness - Post :
- 80.0µin (2.03µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Tube
- Part Status :
- Obsolete
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 800
- Termination :
- Solder
- Type :
- DIP, 0.3" (7.62mm) Row Spacing
- Datasheet :
- 818-AG11D-ESL
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