2-382189-2

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin-Lead

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

-

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Open Frame

Housing Material :

Thermoplastic

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

32 (2 x 16)

Operating Temperature :

-

Packaging :

Tube

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

Diplomate DL

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing