220-4842-00-3303

Manufacturer :

3M

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

250.0µin (6.35µm)

Contact Finish Thickness - Post :

250.0µin (6.35µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polyether Imide (PEI), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

20 (2 x 10)

Operating Temperature :

-55°C ~ 105°C

Packaging :

Bulk

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

OEM

Termination :

Solder

Type :

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing