550-10-600M35-001152

Manufacturer
Preci-Dip
Product Category
Sockets for ICs, Transistors
Description
BGA SOLDER TAIL
Manufacturer :
Preci-Dip
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Brass
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
FR4 Epoxy Glass
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
600 (35 x 35)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Part Status :
Active
Pitch - Mating :
0.050" (1.27mm)
Pitch - Post :
0.050" (1.27mm)
Series :
550
Termination :
Solder
Type :
BGA
Datasheet :
550-10-600M35-001152

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