518-AG11D-ES

Manufacturer
TE Connectivity
Product Category
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 18POS GOLD
Manufacturer :
TE Connectivity
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
25.0µin (0.63µm)
Contact Finish Thickness - Post :
25.0µin (0.63µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Part Status :
Active
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
500
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datasheets
518-AG11D-ES

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