532-AG11D-ESL

Manufacturer
TE Connectivity
Product Category
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 32POS GOLD
Manufacturer :
TE Connectivity
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
5.00µin (0.127µm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Closed Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tube
Part Status :
Active
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
500
Termination :
Solder
Type :
DIP, 0.6" (15.24mm) Row Spacing
Datasheet :
532-AG11D-ESL

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