239-5605-02-0602
- Manufacturer :
- 3M
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polysulfone (PSU), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 39 (1 x 19, 1 x 20)
- Operating Temperature :
- -55°C ~ 150°C
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- -
- Termination :
- Solder
- Type :
- Zig-Zag
- Datasheet :
- 239-5605-02-0602
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