XR2D-2401-N

Manufacturer :

Omron Electronics Inc-EMC Div

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

29.5µin (0.75µm)

Contact Finish Thickness - Post :

29.5µin (0.75µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Carrier

Housing Material :

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

24 (2 x 12)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Bulk

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

XR2

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing