1571539-1

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

180.0µin (4.57µm)

Contact Finish Thickness - Post :

180.0µin (4.57µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Closed Frame

Housing Material :

Polyphenylene Sulfide (PPS), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

20 (4 x 5)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Bulk

Part Status :

Obsolete

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

-

Termination :

Solder

Type :

PLCC