SBU130Z

Manufacturer :

On Shore Technology Inc

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

196.9µin (5.00µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

-

Housing Material :

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

13 (1 x 13)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

SBU

Termination :

Solder

Type :

SIP