1735315-4

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

15.0µin (0.38µm)

Contact Finish Thickness - Post :

15.0µin (0.38µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Closed Frame

Housing Material :

Thermoplastic

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

939 (31 x 31)

Operating Temperature :

-

Packaging :

Tray

Part Status :

Obsolete

Pitch - Mating :

0.050" (1.27mm)

Pitch - Post :

0.050" (1.27mm)

Series :

-

Termination :

Solder

Type :

PGA, ZIF (ZIP)