336-PLS20019-12
- Manufacturer
- Aries Electronics, Inc.
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN SOCKET PGA ZIF GOLD
- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS)
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- -
- Operating Temperature :
- -65°C ~ 125°C
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- PLS
- Termination :
- Solder
- Type :
- PGA, ZIF (ZIP)
- Datasheet :
- 336-PLS20019-12
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