260-5204-01
- Manufacturer
- 3M
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN SOCKET QFN 60POS GOLD
- Manufacturer :
- 3M
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- -
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Open Frame
- Housing Material :
- Polyethersulfone (PES)
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 60 (4 x 15)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.020" (0.50mm)
- Pitch - Post :
- 0.020" (0.50mm)
- Series :
- Textool™
- Termination :
- Solder
- Type :
- QFN
- Datasheet :
- 260-5204-01
Manufacturer related products
Catalog related products
related products
Part | Manufacturer | Stock | Description |
---|---|---|---|
260-0001-00 | EAO | 5,000 | FIXING NUT 8,5MM LONG |
260-0020-00 | EAO | 5,000 | LOCATION STRIP 18 MM |
260-4204-01 | 3M | 34 | CONN SOCKET QFN 60POS GOLD |
260-4T5E | Wakefield-Vette | 268 | HEATSINK TO-5 EPOXY INSUL BLK |
260-4TH5E | Wakefield-Vette | 5,000 | CUP CLIP TRANSISTOR C3488 REV H |
260-6SH5E | Wakefield-Vette | 5,000 | HEAT SINK FOR TO-5 PKG |
260-77 | SONY | 10,000 | Integrated Circuit |
260-9000-00 | EAO | 5,000 | SWITCH BODY FOR MG T 1 3/4 |