HIC-764-SST

Manufacturer :

Samtec Inc

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polyester, Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

64 (2 x 32)

Operating Temperature :

-

Packaging :

Tube

Part Status :

Active

Pitch - Mating :

0.070" (1.78mm)

Pitch - Post :

0.070" (1.78mm)

Series :

HIC

Termination :

Solder

Type :

DIP, 0.75" (19.05mm) Row Spacing