516-AG11D-ESL
- Manufacturer
- TE Connectivity
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN IC DIP SOCKET 16POS GOLD
- Manufacturer :
- TE Connectivity
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 5.00µin (0.127µm)
- Contact Finish Thickness - Post :
- 5.00µin (0.127µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 16 (2 x 8)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 500
- Termination :
- Solder
- Type :
- DIP, 0.3" (7.62mm) Row Spacing
- Datasheet :
- 516-AG11D-ESL
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