508-AG10D-ESL

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

5.00µin (0.127µm)

Contact Finish Thickness - Post :

5.00µin (0.127µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Closed Frame

Housing Material :

-

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

8 (2 x 4)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Tube

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

500

Termination :

Solder

Type :

DIP, 0.3" (7.62mm) Row Spacing