506-AG12D-LF

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

-

Contact Finish Thickness - Post :

-

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

6 (2 x 3)

Operating Temperature :

-55°C ~ 105°C

Packaging :

Tube

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

500

Termination :

Solder

Type :

DIP, 0.3" (7.62mm) Row Spacing