BU400Z-178-HT

Manufacturer :

On Shore Technology Inc

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Copper

Contact Finish Thickness - Mating :

78.7µin (2.00µm)

Contact Finish Thickness - Post :

Flash

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

40 (2 x 20)

Operating Temperature :

-55°C ~ 125°C

Packaging :

Tube

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

BU-178HT

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing