608-CG1T

Manufacturer
TE Connectivity
Product Category
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 8POS GOLD
Manufacturer :
TE Connectivity
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Tin
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
-
Contact Material - Mating :
-
Contact Material - Post :
Phosphor Bronze
Features :
Closed Frame
Housing Material :
Thermoplastic, Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-65°C ~ 125°C
Packaging :
Bulk
Part Status :
Active
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
600
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datasheet :
608-CG1T

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