808-AG10D
- Manufacturer
- TE Connectivity
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN IC DIP SOCKET 8POS GOLD
- Manufacturer :
- TE Connectivity
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 25.0µin (0.63µm)
- Contact Finish Thickness - Post :
- 5.00µin (0.127µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Tube
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 800
- Termination :
- Solder
- Type :
- DIP, 0.3" (7.62mm) Row Spacing
- Datasheet :
- 808-AG10D
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| 808-0043 | Telit | 2 | EVAL BOARD FOR GS2011MIE |
| 808-0044 | Telit | 4 | EVAL BOARD FOR GS2100MIE |
| 808-0045 | Telit | 1 | EVAL BOARD FOR GS2011MIZ |
| 808-0050 | Telit | 2 | EVAL BOARD FOR GS2011MIES |
| 808-0051 | Telit | 5,000 | EVAL BOARD FOR GS2100MIP |
| 808-0052 | Telit | 7 | ADAPTER BOARD WI-FI PMOD |
| 808-0055 | Telit | 5,000 | EVAL BOARD FOR GS2011MIPS |
| 808-0059 | Telit | 1 | RF EVAL DEV KITS IEEE 802.11 |
| 808-0061 | Telit | 5,000 | RF EVAL DEV KIT GS2101MIP |
| 808-0063 | Telit | 3 | EVAL BOARD FOR GS2101M |
| 808-0068 | Telit | 5,000 | EVAL BOARD FOR GS2101MIE |
| 808-0072 | Telit | 5,000 | EVAL BOARD 802.11 |
| 808-0074 | Telit | 6 | GS2200MIZ STARTER KIT |
| 808-0075 | Telit | 5,000 | RF EVAL DEV KIT GS2200MIE |
| 808-01.1.5A | E-T-A | 5,000 | CIR BRKR THRM 5A |