822-AG11D

Manufacturer :

TE Connectivity

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin-Lead

Contact Finish Thickness - Mating :

25.0µin (0.63µm)

Contact Finish Thickness - Post :

80.0µin (2.03µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Open Frame

Housing Material :

Polyester

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

22 (2 x 11)

Operating Temperature :

-55°C ~ 105°C

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

800

Termination :

Solder

Type :

DIP, 0.3" (7.62mm) Row Spacing