211-1-18-003

Manufacturer :

CnC Tech

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polybutylene Terephthalate (PBT)

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

18 (2 x 9)

Operating Temperature :

-55°C ~ 105°C

Packaging :

Tube

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

-

Termination :

Solder

Type :

DIP, 0.3" (7.62mm) Row Spacing