- Manufacturer：
-
- CUI Devices (13)
- Leader Tech Inc. (6)
- Parker Chomerics (2)
- t-Global Technology (147)
- Series：
-
- Material：
-
- Type：
-
- Thickness：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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256 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 305MMX200... |
5,000
In-stock
|
|||
|
|
Parker Chomerics | THERM-A-GAP 974 9X12... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD85000 9" X 9" |
8
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD84750 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD84500 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD84250 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD84000 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD83750 9" X 9" |
9
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD83500 9" X 9" |
6
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD83250 9" X 9" |
5
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD83000 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD82750 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD82500 9" X 9" |
14
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD82250 9" X 9" |
10
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD82000 9" X 9" |
13
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD81750 9" X 9" |
2
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD81500 9" X 9" |
14
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD81250 9" X 9" |
8
In-stock
|