- Manufacturer：
-
- CUI Devices (13)
- Leader Tech Inc. (6)
- Parker Chomerics (2)
- t-Global Technology (147)
- Series：
-
- Material：
-
- Type：
-
- Thickness：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
256 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TPLI220 6W/MK GP FI... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | GAP FILLER TPLI 2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 107MMX53M... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 203.2MMX2... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|