- Manufacturer:
-
- CUI Devices (6)
- Parker Chomerics (2)
- t-Global Technology (20)
- Series:
-
- Part Status:
-
- Type:
-
- Thickness:
-
- Usage:
-
- Outline:
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- Backing, Carrier:
-
- Thermal Resistivity:
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63 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 609.6MMX4... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 584.2MMX4... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 609.6MMX4... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 25.4MMX19... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 17.45MMX1... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 609.6MMX4... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 44.2MMX40... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 34MMX30M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 120MMX90M... |
5,000
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 609.6MMX4... |
2,521
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 457.2MMX3... |
2,869
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 25.4MMX19... |
1,408
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 19.05MMX1... |
1,500
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 21.84MMX1... |
1,851
In-stock
|