- Manufacturer:
-
- CUI Devices (13)
- Laird Thermal Materials (161)
- Leader Tech Inc. (5)
- Parker Chomerics (2)
- t-Global Technology (29)
- Wakefield-Vette (12)
- Series:
-
- Part Status:
-
- Material:
-
- Type:
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- Shape:
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- Thickness:
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- Outline:
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- Backing, Carrier:
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- Thermal Resistivity:
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231 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Laird Thermal Materials | THERM PAD 609.6MMX4... |
2,521
In-stock
|
|||
![]() |
t-Global Technology | THERM PAD 310MMX310... |
737
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
154
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
141
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 457.2MMX3... |
2,869
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
110
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
165
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 101.6MMX1... |
152
In-stock
|
|||
![]() |
Wakefield-Vette | THERM PAD 25.4MMX25... |
204
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 25.4MMX19... |
1,408
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 19.05MMX1... |
1,500
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 21.84MMX1... |
1,851
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 19.05MMX1... |
1,910
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6MMX2... |
56
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6MMX2... |
79
In-stock
|
|||
![]() |
Bergquist / Henkel | THERM PAD 406.4MMX2... |
92
In-stock
|
|||
![]() |
Bergquist / Henkel | THERM PAD 406.4MMX2... |
221
In-stock
|
|||
![]() |
Bergquist / Henkel | THERM PAD 406.4MMX2... |
254
In-stock
|
|||
![]() |
Laird Thermal Materials | THERM PAD 228.6MMX2... |
38
In-stock
|
|||
![]() |
Bergquist / Henkel | THERM PAD 406.4MMX2... |
377
In-stock
|