- Manufacturer：
-
- Bergquist / Henkel (14)
- CUI Devices (24)
- Parker Chomerics (21)
- t-Global Technology (30)
- Series：
-
- Part Status：
-
- Type：
-
- Thickness：
-
- Usage：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
89 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
5,000
In-stock
|
|||
|
|
Parker Chomerics | THERM-A-GAP 974 9X12... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 107X53M... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
11
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 304.80MMX... |
16
In-stock
|
|||
|
|
CUI Devices | THERM PAD 15MMX30M... |
18
In-stock
|