- Manufacturer:
-
- Bergquist / Henkel (14)
- CUI Devices (52)
- Laird Thermal Materials (120)
- Leader Tech Inc. (10)
- Parker Chomerics (31)
- t-Global Technology (94)
- Taica Corporation (16)
- Series:
-
- Part Status:
-
- Material:
-
- Type:
-
- Thickness:
-
- Thermal Conductivity:
-
- Outline:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
- Filter:
337 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
t-Global Technology | THERMAL PAD 19.50X1... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 25X25M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 20X10M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 24X21.0... |
5,000
In-stock
|
|||
![]() |
Parker Chomerics | CHO-THERM 1674 TO-22... |
62
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 16X16M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 19.50X1... |
5,000
In-stock
|
|||
![]() |
Parker Chomerics | CHO-THERM 1674 0.010" ... |
500
In-stock
|
|||
![]() |
Parker Chomerics | CHO-THERM 1674 TO-3 ... |
802
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 20X10M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 10X10M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 19.50X1... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 9.5X9.5... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 20X10M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 11X11M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 10X10M... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 10X5MM... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 10X5MM... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 7.2X6.3... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | THERMAL PAD 10X5MM... |
5,000
In-stock
|