- Manufacturer：
-
- Bergquist / Henkel (14)
- CUI Devices (52)
- Laird Thermal Materials (120)
- Leader Tech Inc. (10)
- Parker Chomerics (31)
- t-Global Technology (94)
- Taica Corporation (16)
- Series：
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- Part Status：
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- Material：
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- Type：
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- Thickness：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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- Filter：
337 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | THERM PAD 20MMX40M... |
19
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
9
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 25X25M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 25X20M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 30X30M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 33.9X33... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 25X25M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 24X21.0... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 54X10M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
10
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 28X28M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 30X30M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 25X25M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 24.2X24... |
5,000
In-stock
|
|||
|
|
Parker Chomerics | CHO-THERM 1674 8X8" 0... |
39
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 30X30M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 24X21.0... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 15MMX15M... |
34
In-stock
|
|||
|
|
CUI Devices | THERM PAD 40MMX40M... |
40
In-stock
|
|||
|
|
t-Global Technology | THERMAL PAD 15.9X3M... |
5,000
In-stock
|