- Manufacturer：
-
- Bergquist / Henkel (14)
- CUI Devices (52)
- Laird Thermal Materials (120)
- Leader Tech Inc. (10)
- Parker Chomerics (31)
- t-Global Technology (94)
- Taica Corporation (16)
- Series：
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- Part Status：
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- Material：
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- Type：
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- Thickness：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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- Filter：
337 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Taica Corporation | THERMAL INTERFAC... |
20
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
20
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
11
In-stock
|
|||
|
|
Bergquist / Henkel | THERM PAD 304.80MMX... |
16
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
7
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
15
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
17
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
9
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
18
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
14
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
3
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
7
In-stock
|
|||
|
|
CUI Devices | THERM PAD 10MMX10M... |
23
In-stock
|
|||
|
|
CUI Devices | THERM PAD 15MMX30M... |
18
In-stock
|
|||
|
|
CUI Devices | THERM PAD 41.25MMX4... |
24
In-stock
|
|||
|
|
Taica Corporation | THERMAL INTERFAC... |
9
In-stock
|
|||
|
|
CUI Devices | THERM PAD 26.25MMX5... |
18
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 30MMX31.2... |
4
In-stock
|
|||
|
|
t-Global Technology | SILICONE THERMAL... |
9
In-stock
|