- Manufacturer：
-
- CUI Devices (39)
- Parker Chomerics (4)
- t-Global Technology (93)
- Series：
-
- Part Status：
-
- Type：
-
- Shape：
-
- Thickness：
-
- Thermal Conductivity：
-
- Outline：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
152 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 150MMX150... |
23
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
34
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 25MMX25M... |
49
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 25MMX25M... |
977
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 20MMX20M... |
143
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 19.5MMX12... |
218
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 20MMX5MM... |
300
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 5MMX5MM... |
444
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 230MMX230... |
10
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 230MMX230... |
10
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 230MMX230... |
20
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 288MMX192... |
9
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8160 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8150 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8140 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF8130 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|