- Manufacturer：
-
- CUI Devices (39)
- Parker Chomerics (4)
- t-Global Technology (93)
- Series：
-
- Part Status：
-
- Type：
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- Shape：
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- Thickness：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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152 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | TFLEX SF860 |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF850 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF840 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF830 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 150MMX150... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 20MMX10M... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 26.25MMX5... |
5
In-stock
|
|||
|
|
CUI Devices | THERM PAD 20MMX40M... |
4
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 30MMX31.2... |
4
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
|||
|
|
CUI Devices | THERM PAD 20MMX20M... |
11
In-stock
|
|||
|
|
CUI Devices | THERM PAD 70MMX70M... |
13
In-stock
|