- Manufacturer：
-
- 3M (98)
- Bergquist / Henkel (32)
- CUI Devices (70)
- Laird Thermal Materials (1086)
- Leader Tech Inc. (63)
- Panasonic (27)
- Parker Chomerics (45)
- t-Global Technology (980)
- Taica Corporation (90)
- Wakefield-Vette (50)
- Series：
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- Part Status：
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- Material：
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- Color：
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- Type：
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- Thickness：
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- Usage：
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- Adhesive：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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- Filter：
2,545 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
3M | THERM PAD 120.6MMX1... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
3M | THERM PAD 32.7MMX32... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 150MMX150... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX SF850 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 406.4MMX4... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX 3170 |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD3200MTG 9X9... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | TFLEX HD3200TG 9X9" |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
|||
|
|
Laird Thermal Materials | THERM PAD 228.6MMX2... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
|||
|
|
t-Global Technology | THERM PAD 150MMX150... |
5,000
In-stock
|