- Manufacturer：
-
- Aavid (33)
- ABB Embedded Power (15)
- Comair Rotron (41)
- Ohmite (33)
- TE Connectivity (5)
- Wakefield-Vette (266)
- Series：
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- Part Status：
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- Material：
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- Packaging：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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948 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
25
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
4
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
21
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
16
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|