- Manufacturer:
-
- Ohmite (1)
- TE Connectivity (2)
- Wakefield-Vette (5)
- Series:
-
- Part Status:
-
- Shape:
-
- Length:
-
- Width:
-
- Diameter:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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14 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X24.5M... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
612
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 21MM... |
22
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
4
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 28MM... |
143
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 28MM... |
8,691
In-stock
|
|||
![]() |
Ohmite | HEATSINK DUAL FO... |
23
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 28MM... |
996
In-stock
|