- Manufacturer：
-
- CUI Devices (9)
- Wakefield-Vette (3)
- Material：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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19 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
96
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
104
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,827
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,883
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
315
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
193
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
4
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
2,074
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,352
In-stock
|
|||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
716
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
293
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
1,241
In-stock
|