- Manufacturer：
-
- Aavid (338)
- Apex Microtechnology (22)
- Assmann WSW Components (119)
- CUI Devices (100)
- Ohmite (68)
- TE Connectivity (12)
- Wakefield-Vette (363)
- Series：
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- Material：
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- Packaging：
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- Type：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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1,839 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK THERMAL... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|