- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (22)
- Series：
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- Part Status：
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- Material：
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- Shape：
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- Length：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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57 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
14
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X9.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X9.5M... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
15
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
14
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
44
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
583
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
106
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
575
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1,353
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
3,816
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 29X12MM S... |
5,000
In-stock
|