- Manufacturer：
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- Aavid (3)
- CUI Devices (1)
- Wakefield-Vette (25)
- Series：
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- Part Status：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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58 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
9
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X9.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X9.5M... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
38
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
997
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
128
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
579
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
581
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
194
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
176
In-stock
|
|||
|
|
Aavid | HEATSINK BGA W/AD... |
1,080
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
128
In-stock
|