- Manufacturer：
-
- Aavid (1)
- CUI Devices (12)
- Ohmite (16)
- Wakefield-Vette (14)
- Part Status：
-
- Packaging：
-
- Width：
-
- Diameter：
-
- Package Cooled：
-
- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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43 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
1
In-stock
|
|||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 W/S... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK TO-5 .5" B... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | TO-268 HEAT SINK AN... |
714
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
2,973
In-stock
|
|||
|
|
Wakefield-Vette | TO-268 HEAT SINK AN... |
1,217
In-stock
|
|||
|
|
Wakefield-Vette | TO-268 HEAT SINK AN... |
1,217
In-stock
|
|||
|
|
Wakefield-Vette | TO-268 HEAT SINK AN... |
750
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1,405
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
9,632
In-stock
|