- Manufacturer：
-
- Aavid (1)
- Comair Rotron (1)
- CUI Devices (6)
- Ohmite (7)
- Wakefield-Vette (13)
- Series：
-
- Part Status：
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- Material：
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- Shape：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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76 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
6
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 20... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 25MM... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
5,000
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
5,000
In-stock
|
|||
|
|
Aavid | BGA HEAT SINK |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 25MM... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
5
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
93
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-247 TO... |
54
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
755
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 25MM... |
524
In-stock
|